Overview

Week 3 focused on the transition from conceptual diagrams to technical groundwork. The team pivoted to deep-dive component research and strategic industry outreach, ensuring the VertexShell project has both a solid hardware foundation and a path toward professional partnership.

What We Did

Circuit & Component Investigation — Conducted a comprehensive technical review of our core hardware.

Partnership Outreach — Drafted and dispatched our first round of formal emails to potential industry partners. These communications aim to establish early-stage collaborations and explore sponsorship opportunities.

Web Development — Continued the iterative update of the VertexShell official website. We refined the project documentation, updated the tech stack descriptions, and ensured our digital presence accurately reflects our current research milestones.

Key Decisions

• Research-First Approach: Decided to finalize all component profiles and logic-level requirements before committing to physical assembly.

Challenges

The primary challenge this week was the administrative and technical bottleneck of cross-referencing global safety standards with our chosen components. Finding the “sweet spot” between professional-grade sensor accuracy and low-power consumption required extensive datasheet comparison. Additionally, crafting a compelling pitch for potential partners while our hardware is still in the research phase required careful balancing of our long-term vision versus current technical benchmarks.

Next Steps

Follow up on partnership inquiries, begin the initial PCB schematic in Altium based on our research, and continue expanding the website’s technical documentation.